Siemens Deploys 300 Autonomous Mobile Robots in Semiconductor Factory

Siemens has deployed a fleet of 300 autonomous mobile robots (AMRs) at its semiconductor fabrication facility in Regensburg, Germany. The robots, developed by Siemens’ Digital Industries division in collaboration with Mobile Industrial Robots (MiR), are designed to transport wafer cassettes and other materials between cleanroom bays. This deployment marks one of the largest known installations of AMRs in a semiconductor fab worldwide.

The technical core of the system is a centralized traffic management platform that uses a proprietary algorithm to optimize robot paths in real time. Each AMR is equipped with dual LiDAR sensors, three RGB cameras, and an inertial measurement unit (IMU) for localization. The robots operate at a top speed of 1.5 m/s and can carry payloads up to 200 kg. Battery life is rated at 10 hours per charge, with autonomous recharging stations positioned along high-traffic routes.

Siemens reports that the AMRs have reduced internal transport time by 40% compared to the previous manual cart-based system. The company also notes a 25% decrease in wafer handling defects due to reduced human intervention. The robots are integrated with the factory’s manufacturing execution system (MES) using OPC UA over TSN for deterministic communication. Siemens claims this is the first time such a large swarm has been coordinated in a Class 1 cleanroom environment (ISO 3 equivalent).

Each AMR uses a modular chassis that can be configured with different top modules depending on the payload—open bins for cassettes or sealed containers for chemicals. The robots communicate via a private 5G network, ensuring latency under 10 ms. In the event of a network failure, the robots have onboard fallback maps and can navigate using visual SLAM.

The deployment was phased over six months. In the first phase, 50 robots covered the most critical path between the photolithography and etch bays. Subsequent phases expanded coverage to all material handling zones. Siemens plans to add 150 more robots by Q3 2024.

This development is significant for the robotics industry as it demonstrates that very large fleets of AMRs can be deployed in high-stakes environments like semiconductor fabs. It also shows that standardization of communication protocols (OPC UA) and modular hardware designs can scale. The financial terms of the deployment were not disclosed, but similar projects typically run between $10 million and $30 million for hardware and integration.

Siemens is now offering the same solution to other semiconductor manufacturers and is in talks with two memory chip makers. The company expects the market for AMRs in semiconductor fabs to grow at a CAGR of 28% through 2030. This report is based on a press release from Siemens and on-site observations by our editorial team.

Source: Robot Design Net